E-REON expanded its in-house rapid-prototyping and electronics assembly capabilities with an Essemtec FOX pick-and-place system with integrated dispensing and an IBL BLC vapor-phase soldering system.
Supporting complex RF assemblies
The investment addressed production challenges associated with complex RF hardware, including placing components inside cavities in metal-backed PCBs and soldering high-mass components and DBC solid-copper backplates to PCBs.
Vapor-phase soldering produced a successful result from the first test, while the FOX system provided the flexibility required for 2.5D placement and dispensing.
Faster prototype turnaround
Bringing these processes in-house reduced typical prototype assembly time to approximately two days. Outsourcing comparable complex PCB assemblies had previously required 30 to 45 days for each design revision.
The rapid-prototyping centre also strengthened design-for-manufacture practices and process-engineering knowledge. Customers could now use the same supplier for both hardware development and subsequent production, while the equipment could also be configured for serial manufacturing.